POSTER SESSION

Monday 19

16:00 – 18:30

P1 Near field scanning microwave microscope using a coaxial cavity resonator for the characterization of semiconductor structures

B. Abadlia Bagdad, F.Gamiz

Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, 18071 Granada, Spain

P2 Energy Harvesting Power Management Circuit Design in 22nm FDSOI Technology

Z. E. Kaya, S. B. Tekin, S. Kalem

Informatics & Information Security Research Center TUBITAK-BILGEM, Gebze, Kocaeli, Turkey

P3 Ferroelectric FET as a Low Power Device with reduced SCE and RDF Effect

Ullas Pandey1, Koushik Guha1, K.L.Baishnab1,Brinda Bhowmick1 and Madhumita Paul1

1Dept. of ECE, National Institute of Technology, Silchar, Assam, 788010, India

P4 Indium oxide nanostructures for RRAM integration in CMOS-BEOL

A. Souifi1, E. A. León Pérez1, P.-V. Guenery1, K. Ayadi1, S. Brottet1, N. Baboux1, L. Militaru1, J. Moeyaert2, S. Labau2, T. Baron2, and S. Blonkowski3

1Univ. Lyon, Institut des Nanotechnologies de Lyon UMR CNRS 5270, INSA Lyon, Villeurbanne, France.

2Univ. Grenoble Alpes, Laboratoire des Technologies de la Microélectronique, UMR CNRS 5129, Grenoble, France.

3STMicroelectronics, 850 Rue Jean Monnet, 38920 Crolles, France

P5 Investigation of Memory Effect with Voltage or Current Charging Pulse Bias in MIS Structures based on codoped Si-NCs

Andrzej Mazurak, Jakub Jasiński, Robert Mroczyński

Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Koszykowa 75, 00-662 Warsaw, Poland

P6 Reliability of Z2-FET

Sehyun Kwon1,5, Navarro Carlos2, Francisco Gamiz2, Philippe Galy3, Asen Asenov4, Sorin Cristoloveanu5, Jinho Ahn6, and Yong Tae Kim1

1Semiconductor Materials and Device Lab, Korea Institute of Science and Technology, Seoul 02792, Korea

2Nanoelectronics Research Group, University of Granada, 18071 Granada, Spain

3STMicroelectronics, 38920 Crolles, France, Grenoble, France

4University of Glasgow, Glasgow G128QQ, U.K

5IMEP-LaHC, Minatec, Grenoble INP, Univ. Grenoble Alpes, CNRS, 38016 Grenoble, France

6Division of Materials Science and Engineering, Hanyang University, Seoul 04763, Korea

P7 Electrical Characterization of HfO2 Based Resistive RAM Devices Having Different Bottom Electrode Metallizations

S. B. Tekin1, S. Kalem1, Z. E. Kaya1, E. Jalaguier2

1Informatics & Information Security Research Center TUBITAK-BILGEM, Gebze, Kocaeli, Turkey

2CEA-LETI, 17 Avenue des Martyrs, 38054, Grenoble, France

P8 Design of Dickson Rectifier for RF Energy Harvesting in 28 nm FD-SOI technology

M. Awad, P. Benech and J-M Duchamp

The University Grenoble Alpes, CNRS, Grenoble INP, IMEP-LAHC, 38000 Grenoble, France

P9 A Low Noise Wideband VCO with 4 bit Switched Capacitor Array

K.L. Baishnab1, K. Guha1, S. Chanda1, N.M Laskar1, Madhumita Paul1

1National Institute of Technology, Silchar, Assam. 788010. India

P10 FoMPy: A figure of merit extraction tool for semiconductor device simulations

Gabriel Espiñeira, Natalia Seoane, Daniel Nagy, Guillermo Indalecio, Antonio J. García Loureiro

Centro Singular de Investigación en Tecnoloxías da Información, Univ. of Santiago de Compostela, Spain

P11 Impact of TFET Reverse Currents Into Circuit Operation: A Case Study

Juan Núñez

Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Uni. de Sevilla)

Av. Américo Vespucio s/n, 41092, Sevilla (Spain).

P12 Nanoindentation effects on the electrical caracterization in Ψ-MOSFET configuration

Licinius Benea1, Maryline Bawedin1, Cécile Delacour2, Sorin Cristoloveanu1, Irina Ionica1

1IMEP-LaHC, Minatec, Grenoble INP, Univ. Grenoble Alpes, CNRS, 38016 Grenoble, France

2Néel Inst., CNRS, 38042 Grenoble, France

P13 Impact of Electron Effective Mass Variation on the Performance of InAs/GaSb Electron-Hole Bilayer Tunneling Field-Effect Transistor

J. L. Padilla1, C. Medina-Bailón2, M. Rupakula3, C. Alper3, C. Sampedro1, F. Gámiz1 and A. M. Ionescu3

1Departamento de Electrónica, Universidad de Granada, Granada, Spain. ES-18071

2Device Modelling Group, University of Glasgow, Glasgow, UK, G12 8QQ

3Nanoelectronic Devices Laboratory, École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland, CH-1015

P14 Hole mobility of cylindrical GaSb nanowires

Francisco G. Ruiz1, Enrique G. Marín2, Celso Martínez-Blanque1, I. M. Tienda-Luna1, J. M. Gonzalez-Medina1, A. Toral1, L. Donetti1, A. Godoy1

1Dpto. Electrónica y Tec. Computadores, Fac. de Ciencias, Univ. Granada, Fuentenueva S/N, 18071 Granada, Spain

2Dipto. di Ingegneria dell Informazione, Università di Pisa, Via G. Caruso 16, 56122 Pisa, Italy.

P15 New method for self-heating estimation using only DC measurements

C. A. B. Mori1, P. G. D. Agopian1,2, J. A. Martino1

1LSI/PSI/USP, University of Sao Paulo, Sao Paulo, Brazil

2Sao Paulo State University (UNESP), Sao Joao da Boa Vista, Brazil

P16 Profiling Border-Traps by TCAD analysis of Multifrequency CV-curves in Al2O3/InGaAs stacks

E. Caruso1, J. Lin1 K. F. Burke1, K. Cherkaoui1, D. Esseni2, F. Gity1, S. Monaghan1, P. Palestri2, P. Hurley1, L. Selmi3

1Tyndall National Institute University College Cork, Cork, Ireland

2DPIA, University of Udine, Via delle Scienze 206, 33100, Udine, Italy

3DIEF, University of Modena and Reggio Emilia, Via P. Vivarelli 10/1, 41125, Modena, Italy

P17 MS-EMC vs. NEGF: A Comparative Study Accounting for Transport Quantum Corrections

C. Medina-Bailon1, C. Sampedro1, J.L. Padilla1, A. Godoy1, L. Donetti1, F. Gamiz1 and A. Asenov2

1Departamento de Electrónica y Tecnología de Computadores, Universidad de Granada, 18071 Granada, Spain

2School of Engineering, University of Glasgow, Glasgow G12 8LT, Scotland, UK

P18 Switching Current Reduction in Advanced Spin-Orbit Torque MRAM

Viktor Sverdlov, Alexander Makarov, and Siegfried Selberherr

Institute for Microelectronics, TU Wien, Gußhausstraße 27-29, 1040 Vienna, Austria

P19 Finite Element Simulation of 2D Percolating Silicon-Nanonet Field-Effect Transistor

T.Cazimajou, M.Mouis, G.Ghibaudo

Univ. Grenoble Alpes, CNRS, Grenoble INP, IMEP-LAHC, 38016 Grenoble, France

P20 Investigation on built-in BJT in FD-SOI BIMOS

T. Bedecarrats1,2,3, P. Galy1, S. Cristoloveanu2, C. Fenouillet-Beranger3

1STMicroelectronics, 850 rue jean Monnet, 38926 Crolles Cedex, France

2Univ. Grenoble Alpes, IMEP-LAHC, Grenoble INP Minatec, CNRS, F-38000 Grenoble, France

3CEA, LETI, Minatec Campus, and Univ. Grenoble Alpes, 38054 Grenoble, France

P21 Simulation and Automated Characterisation of Optimal Load for Flexible Composite Generators Based on Piezoelectric ZnO Nanowires

D. Menin1,2, M. Parmar1, R. Tao1, P. Oliveira1, M. Mouis1, L. Selmi3 and G. Ardila1

1Univ. Grenoble Alpes, CNRS, Grenoble INP, IMEP-LaHC, F-38000 Grenoble, France

2Università degli Studi di Udine, DPIA, Udine, Italy

3IUNET Consortium and DIEF, Università di Modena e Reggio Emilia, Italy

P22 Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries

Xaver Klemenschits, Siegfried Selberherr, and Lado Filipovic

Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Vienna, Austria

P23 A Design-oriented Charge-based Simplified Model for FDSOI MOSFETs

Alessandro Pezzotta1, Farzan Jazaeri1, Heorhii Bohuslavskyi2, Louis Hutin2, Christian Enz1

1ICLAB, École Polytechnique Fédérale de Lausanne (EPFL), Neuchâtel, Switzerland

2CEA Leti, Grenoble, France

P24 Characterization of gate overlap capacitances and effective channel size in MOSFETs

Daniel Tomaszewski, Grzegorz Głuszko, Jolanta Malesińska

Institute of Electron Technology (ITE), Al. Lotników 32/46, 02-668 Warsaw, Poland

P25 Effect of Schottky Barrier Contacts on Measured Capacitances in Tunnel-FETs

A. Farokhnejad1,2, M. Schwarz1, M. Graef1, F. Horst1,2, B. Iñíguez2, F. Lime2 and A. Kloes1

1NanoP, TH Mittelhessen University of Applied Sciences, Giessen, Germany

2DEEEA, Universitat Rovira i Virgili, Tarragona, Spain

P26 An Efficient Model for Charge and Gate Capacitance in III-V Cylindrical Nanowire Transistors

Mohit D. Ganeriwala1, Enrique G. Marin2, Francisco G. Ruiz3 and Nihar R. Mohapatra1

1Department of Electrical Engineering, Indian Institute of Technology, Gandhinagar, India

2Department of Information Engineering, University of Pisa, Italy

3Department of Electronics, University of Granada, Spain

P27 Design Benefits of Self-Cascode Configuration for Analog Applications in 28nm FDSOI Technology

Lígia Martins d’Oliveira1, Michelly de Souza1, Valeriya Kilchytska2, Denis Flandre2

1Centro Universitário FEI, São Bernardo do Campo, Brazil

2ICTEAM, Université catholique de Louvain, Louvain la-Neuve, Belgium.

P28 Impact of BOX thickness and Ground-Plane on non-linearity of UTBB FD-SOI MOS Transistors

Mandar S. Bhoir and Nihar R. Mohapatra

Department of Electrical Engineering, Indian Institute of Technology Gandhinagar (IIT GN), Gujarat, India

P29 Multilevel Parallelization Approach to Estimate Spin Lifetime in Silicon: Performance Analysis

J. Ghosh1, D. Osintsev2, V. Sverdlov2, and S. Ganguly1

1Department of Electrical Engineering, Indian Institute of Technology, Mumbai, India

2Institute for Microelectronics, TU Wien, Gußhausstraße 27–29/E360, A–1040 Wien, Austria

P30 Realization of Vertical Ge nanowires for Gate-All-Around transistors

M. Liu1, K. Mertens1, S. Glass1, S. Trellenkamp2, S. Mantl1, D. Buca1, Q.T. Zhao1

1Peter-Grünberg-Institut (PGI 9) and JARA-Fundamentals of Future Information Technologies, Forschungszentrum Jülich, Germany

1Helmholtz Nano Facility (HNF), Germany

P31 Scaling down a level shifter circuit in 28 nm FDSOI Technology

Saikat Chatterjee, Ulrich Rückert

Cognitronics and Sensor Systems Group CITEC, Bielefeld University 33619, Germany

P32 Effects of Post Metallization Annealing on InGaAs-on-Insulator MOSFETs on Si

Cezar B. Zota, Clarissa Convertino, Daniele Caimi, Marilyne Sousa and Lukas Czornomaz

IBM Research GmbH Zürich Laboratory, Säumerstrasse 4, CH-8803 Rüschlikon, Switzerland

P33 Linear Distortion Analysis of 3D Double Gate Junctionless Transistor with High-k Dielectrics

A. Baidya1, S. Baishya2 and T. R. Lenka2

1Department of Electronics and Communication Engineering, Mizoram University, Aizawl, India, 796004

2Department of Electronics and Communication Engineering, National Institute of Technology Silchar, Assam, India, 788010

P34 InSb Nanocrystals Containing SOI Structures: Preparation and Properties

I.E. Tyschenko, V.A. Volodin, A.G. Cherkov, and V.P. Popov

A.V. Rzhanov Institute of Semiconductor Physics, Novosibirsk, Russia

P35 Detailed analysis of frequency-dependent impedance in pseudo-MOSFET on thin SOI film

S. Sato1,2, G. Ghibaudo2, L. Benea2, Y. Omura1 and S. Cristoloveanu2

1Faculty of Engineering Science, Kansai University, Osaka, Japan

2IMEP-LAHC, Grenoble Institute of Technology, Minatec, Grenoble, France

P36 Potential of Thin (~10 nm) HfO2 Ferroelectric FDSOI NCFET for Performance Enhancement in Digital Circuits at Reduced Power Consumption

S. Qureshi and Shruti Mehrotra

Department of Electrical Engineering, Indian Institute of Technology Kanpur-208016, India

P37 Three P-Silicon Layers in Reliable Lateral Double Diffused Metal Oxide Semiconductor Transistor

Mahsa Mehrad

School of Engineering, Damghan University, Damghan, Iran

P38 Inserting PN Junction in a Power Device for Achieving Improved Figure Of Merit 

Meysam Zareiee, Hesam Salami

School of Engineering, Damghan University, Damghan

P39 Design of Wideband Cascode Low Noise Amplifier using E-mode GaN based MOSHEMT for RF and Microwave Applications

D. K. Panda, and T. R. Lenka

Microelectronics and VLSI Design Group, Department of Electronics and Communication Engineering, National Institute of Technology Silchar, Assam, 788010, India

P40 Analytical Model Development for Gate  Workfunction Engineered Short Channel E-mode n-Polar GaN MOS-HEMT

D. K. Panda, and T. R. Lenka

Microelectronics and VLSI Design Group, Department of Electronics and Communication Engineering, National Institute of Technology Silchar, Assam, 788010, India