Submissions

High-quality contributions in the following areas are solicited:

  • Modeling and simulation of all types of semiconductor devices, including FinFETs, GAA FETs, ultra-thin SOI devices, emerging memory devices, new material-based nanodevices, optoelectronic devices, TFTs, sensors, power electronic devices, spintronic devices, tunnel FETs, SETs, organic electronic devices, and bioelectronic devices
  • Modeling and simulation of all sorts of semiconductor processes, including first principles material design, and growth simulation of nano-scale fabrication
  • Fundamental aspects of device modeling and simulation, including quantum transport, thermal transport, fluctuation, noise, and reliability
  • Compact modeling for circuit simulation, including low-power, high frequency, and power electronics applications
  • Process/device/circuit co-simulation in context with system design and verification
  • Equipment, topography, lithography modeling
  • Interconnect modeling, including noise and parasitic effects
  • Numerical methods and algorithms, including grid generation, user-interface, and visualization
  • Metrology for the modeling of semiconductor devices and processes
  • Multiscale approach from First Principles to TCAD simulations
  • Estimation with TCAD and machine learning
  • Neuromorphic devices and quantum computing
  • Multi-physics simulation

Abstract submission instructions

To submit an abstract it is necessary to create a user on the conference platform by following this link. After that, you will find the “Submit a Paper” button in your personal information panel.

  • Abstracts are limited to two A4 pages including tables and figures.
  • Abstracts must be submitted in PDF format.
  • Abstracts sent by e-mail or postal mail will NOT be considered

The abstract submission deadline is April 8.

The abstract submission period has been extended: the updated deadline is April 22  (at midnight, Anywhere on Earth AoE time zone).

Submission of 4-page paper for accepted abstracts

The authors of accepted abstracts are invited to submit a 4-page version of their paper to a special issue of Solid-state Electronics.

Please, submit your paper directly via the SEE journal submission web page https://www.editorialmanager.com/sse/Default.aspx by selecting the Special Issue [VSI: LETTERS SISPAD-2022].

Guide for Authors is available at https://www.elsevier.com/journals/solid-state-electronics/0038-1101/guide-for-authors

According to the above Guide, “You may choose to submit your manuscript as a single Word or PDF file to be used in the refereeing process. Only when your paper is at the revision stage, will you be requested to put your paper in to a ‘correct format’ for acceptance and provide the items required for the publication of your article.” Please note that the 4 pages limit applies to two columns papers as edited by the publisher after acceptance: to make sure submitted manuscripts satisfy the 4-page limit, they should not exceed 2000 words (including the list of authors, abstract, references and figure captions) and 6-8 figures. The journal provides no Word template while a LaTex template is available at https://www.elsevier.com/authors/policies-and-guidelines/latex-instructions.

Submission deadline for the 4-page manuscripts is June 30th.